112-layer 3D NAND SSDs

Leading the Intelligent Future

Industries are growing, and technologies are advancing. We need better solid storage devices to support the embedded servers, AIoT, smart applications, and other digital transformation. Transcend introduces a series of brand-new 112-layer 3D NAND SSDs to respond to the call. Unrivaled performance is within your reach.

Better I/O Performance

50% higher throughput than 96-layer flash.

Higher Die Capacity

Capacity per die reaches 1Tb, 50% increase compared to the previous generation.

Great Endurance

3,000 P/E Cycles to withstand heavy-duty workloads.

High-quality NAND Flash

Highest quality chips and controller ICs manufactured by world leading suppliers.

Thermal Management

Dynamic Thermal Throttling allows SSDs to self-cool and increase reliability.

Extended Temperature

Stable operation under temperatures ranging from -20℃~75℃.

Shock Resistant

Key components fortified by Corner Bond technology to enhance shock and vibration resistance.

Rigorously Tested

Strict reliability, compatibility, intense read/write cycles, and dynamic burn-in quality tests to ensure product quality.

Comprehensive Product Line

Various form factors covering SATA III 2.5", M.2, mSATA, and PCIe to suit different systems and interfaces.


5G Communication


Deep Learning

Smart Transportation

Smart Surveillance

Factory Automation

Leading the way to success

  • More than 30 years of experience in memory manufacturing
  • Sole factory operations based in Taiwan
  • Dedicated R&D team customizes firmware to fit your special needs
  • Good product lifecycle management (PLM) ensures stable supply
  • 13 offices worldwide, instant technical support

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